International Microelectronics and Packaging Society

Filing Period

Jul 1, 2010 to Jun 30, 2011

Signed

Mar 29, 2012

Return Version

2010v3.4

Gross Receipts

$1,379,321

Mission

Major Activities

Activity 2

Membership: joining imaps gives members access to the largest society dedicated to the advancement and growth of the use of microelectronics and electronic packaging through professional and public education, the dissemination of information (by symposia, conferences, workshops, and other efforts) and the promotion of the society's portfolio of technologies. Imaps currently has more than 5,000 members in the united states and more than 4,000 international members around the world.

Activity 3

The device packaging conference will feature keynote speakers, technical sessions, professional development courses, and a vendor exhibition and technology showcase. The conference aims to provide a focused forum to hear and discuss the latest technological developments in 5 topic areas related to microelectronics packaging: optoelectronics, mems, flip chip technologies, copper/low-k and 3d packaging. Technical presentations in these 5 topical areas range from early stage design work and r&d, to systems manufacturing and production operations. The professional development courses which are offered, as well as focused on the microelectronics and packaging aspects of the vendor exhibition and technology showcase, are focused on the microelectronics and packaging aspects of these 5 topical areas and provide a very valuable added resource to people attending the conference. There are several networking receptions and gatherings throughout the week, including the opening reception, meals and other social events. This conference is a major forum for the exchange of knowledge and provides numerous opportunities to network and meet leading experts in these 5 fields. The conference was organized to attract a fairly diverse group of people, across many different functional groups and experience levels within both industry and academics. People who benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales and marketing professionals.

Filer

EIN

36-3680991